Electronics Assembly Knowledge, Vision & Wisdom
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Jan 19, 2017
Issues With Components Near PCB Edges
Issues With Components Near PCB Edges
What issues are we likely to see whan we place BGA components very close to PCB edges? What impact might it have on reliability? Will, equipment, screening, placement, or re-flow require modification? The Assembly Brothers, Jim Hall and Phil Zarrow, answer these questions.
Board Talk
What is Causing Oxidation?
After 2-3 months in the field we are noticing the silver connectors on our circuit boards have turned black, and appear to have heavy oxidation.
Ask the Experts
CGA Trends and Capabilities
CGA Trends and Capabilities
The Column Grid Array (CGA) module is a high reliability JEDEC format package, with several options adaptable to end user needs.
Production Floor
Managing the Internet of (Hackable) Things
Managing the Internet of (Hackable) Things
The total economic benefit of IoT in 2025 could be up to $11 trillion per year. This will open opportunities for wealth creation and legal concerns.
Technology Briefing
Evaluation of New SMT Stencil Materials
This paper covers a study undertaken to quantify the effects of stencil materials on paste deposition in high volume production processes.
Analysis Lab
Pb-Free Alloy Alternatives
Pb-Free Alloy Alternatives
This paper compares solder compositions and micro alloyed SAC solders in terms of assembly and mechanical/thermal fatigue properties.
Materials Tech
Defluxing for New Assembly Requirements
This paper covers selecting the most effective, rugged defluxing option relative to the circuit board assembly design.
Production Floor
Ask the Experts
Effects of Ultrasonic Cleaning
Can ultrasonic cleaning have an adverse effect on crystals or other components on a PCBA?
Ask the Experts
Side Wall Wetting Induced Void Formation
In this study the authors examine the mechanism of void formation in the processing of microbumps.
Analysis Lab
Larger Stencil Apertures and Type 4 Paste
Larger Stencil Apertures and Type 4 Paste
What is your experience with larger size apertures and type four solder paste for non-collapsible BGA and CGA type solder joints?
Board Talk
Second Generation Pb-Free Alloys
Paper covers shortcomings of current alloys, namely SAC305, and presents data for various new alloys which show promise as replacement materials.
Materials Tech
         
How Crowdfunding Influences Innovation
How Crowdfunding Influences Innovation
For entrepreneurs, crowdfunding can be a source of funding for product development, changing how entrepreneurs bring products to market.
Technology Briefing
Evaluation of Stencil Materials, Suppliers and Coatings
Evaluation of Stencil Materials, Suppliers and Coatings
An experiment is devised to identify the best stencil option for a highly miniaturized, densely populated SMT product.
Production Floor
Ask the Experts
Acceptable Conductor Repair
An operator attempted to repair damaged conductors using buss wire coated with epoxy. Is this acceptable? Is their an IPC spec for this?
Ask the Experts
The Puzzling Z-Axis Adhesive
The Puzzling Z-Axis Adhesive
A new type of z-axis conductive adhesive was mysteriously switching on and off. The cycle was endlessly repeated. What was the cause?
Mysteries of Science
Cartoon
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