Electronics Assembly Knowledge, Vision & Wisdom
May 25, 2017
Issues With Fillets on Via Holes?
Issues With Fillets on Via Holes?
During wave solder some of the vias have concave fillets giving them a dimple effect. What can we do to create flatter fillets on via holes? The Assembly Brothers, Jim Hall and Phil Zarrow, share their insight and experiences.
Board Talk
Environment Impact on Assembly, Printing and Reflow
Is particle count a good parameter to control? How can having high particle concentrations affect our PCB assembly process or reflow process?
Ask the Experts
Process Control of Ionic Contamination in Assembly of Electronic Circuits
Process Control of Ionic Contamination in Assembly of Electronic Circuits
This paper reviews a testing protocol based on IPC-TM 650 2.3.25 to enable monitoring of ionic contamination within series production.
Analysis Lab
How Commercial Drones Will Optimize the Supply Chain
How Commercial Drones Will Optimize the Supply Chain
Drone vehicles are becomming cheaper, smarter, more powerful, and more reliable. How will this technology enter the commercial supply chain?
Technology Briefing
Nickel Hydroxide Corrosion Residues on Ceramic Packages
The findings of this study should help process engineers resolve package-related problems when nickel-gold finishes are utilized.
Analysis Lab
High Reliability, Stress-free Copper Deposit
High Reliability, Stress-free Copper Deposit
To overcome the challenge of metallizing smooth surfaces, a new stress-free electroless copper was developed to serve this important sector.
Materials Tech
Mechanical Shock and Drop Reliability Evaluation of the BGA Solder Joint Stack-Ups
Mechanical Shock and Drop Reliability Evaluation of the BGA Solder Joint Stack-Ups
This paper investigates the Mechanical Shock and Drop Reliability of SnAgCu ball Flip Chip BGA solder joints.
Production Floor
Ask the Experts
Twisting Multi-strand Wires
Should multi-strand wires be twisted before they are tinned with solder? What are the benefits of twisting prior to tinning?
Ask the Experts
Flux Residue Influence on Surface Insulation Resistance
Two liquid flux and two newly developed products build up the basic models. The results also provide a scientific approach to design highly reliable products.
Analysis Lab
PCBA Inspection Concerns
PCBA Inspection Concerns
We inspect PCBAs on a relatively hard ESD mat. Will moving the PCBs on the mat will scratch and stress the soldered components on the bottom side?
Board Talk
Low Cost Alternative to SAC Alloys
Paper discusses some new SAC alloy options, comparing performance to current low-cost options, and considers approaches to enhance the performance.
Materials Tech
The Brave New World of Human Enhancement
The Brave New World of Human Enhancement
As technology converges, our lives are being reshaped in ways that challenge our abilities as humans to even imagine the possibilities.
Technology Briefing
Jetting Solder Paste Opens Up New Possibilities
Jetting Solder Paste Opens Up New Possibilities
Today Jet Printing is no longer seen as a futuristic technology but it has proven itself and the technology is still gaining momentum.
Production Floor
Initial Screen Print Test Board
Is it recommended to print one cycle before printing the first production board? I could use a scrap board or blank plastic card for the first print.
Ask the Experts
Radioactivity Warning Surprise
Radioactivity Warning Surprise
A chemist had a hunch that radioactive contamination might have come from a window. How could a window be the cause?
Mysteries of Science
Cartoon
"Instead of raising your pay, would you be okay if I just lowered everyone else's pay?"
Copyright © Randy Glasbergen
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