Electronics Assembly Knowledge, Vision & Wisdom
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Feb 23, 2017
How To Determine Stencil Thickness
How To Determine Stencil Thickness
On what basis is stencil thickness decided in the case of BGA's or fine pitch components? The Assembly Brothers, Jim Hall and Phil Zarrow, address this question.
Board Talk
Can Water be Harmful to Electronics Components?
A new quality assurance engineer insists that electronics components should not be cleaned with water. Can you enlighten us?
Ask the Experts
Industry Progress from 2005 to Present Day
Industry Progress from 2005 to Present Day
This paper compares assembly and test of various 1.0 mm pitch CBGAs conducted between 2005 and 2014.
Production Floor
Automated Program Synthesis
Automated Program Synthesis
Researchers are using a model of programming "automated program synthesis," computers generate pieces of code based on a user's intent.
Technology Briefing
Reliability Impact of Partial Pad Craters
PCB pad craters are associated with single overstress events that cause immediate failure. This examines the effects of partial pad craters on reliability.
Analysis Lab
Assembly and Reliability Investigation of PoP
Assembly and Reliability Investigation of PoP
This paper discusses the results of independent experiments to address aspects of successful Package on Package integration.
Materials Tech
Control for Cost-Effective Selective Soldering
Paper gives a comprehensive survey about the process steps to monitor and control a cost-effective selective soldering process.
Production Floor
Ask the Experts
Wave Solder Process Issue
We are seeing deformed, unwetted solder joints after moving past the wave solder air knife. What could be causing this?
Ask the Experts
Test Optimization to Improve Rework
Paper reviews how to use test machines to diagnose defects and how to reduce defects from a SMT line.
Analysis Lab
How to Reduce Voiding on QFN Components
How to Reduce Voiding on QFN Components
I'm concerned about voiding in the central ground planes of my QFN components. What can I do and how concerned should I be?
Board Talk
Long Term Thermal Reliability of Printed Circuit Board Materials
This paper describes the purpose, methodology, and results to date of thermal endurance testing performed at the company.
Materials Tech
         
Robots At War
Robots At War
The U.S. military's successful deployment of drones in combat provides a glimpse into the future of warfare.
Technology Briefing
Risk and Solution for No-Clean Flux Not Dried Under Components
In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed.
Production Floor
Ask the Experts
Solder Hardness Comparison
While running a solder paste comparison through our SMT and ICT processes we found that one solder was harder than another. Why?
Ask the Experts
Lightning Stikes in the Chemistry Lab
Lightning Stikes in the Chemistry Lab
As a lightning bolt hit near a lab, a blue spark jumped from a radio in the lab room to a student. Was the spark lightning?
Mysteries of Science
Cartoon
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