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Knowledge, Vision & Wisdom Sep 1, 2016
Solder Paste Volume for BGA Rework
Since rework can never be as controlled or consistent as original assembly, should we use slightly more paste during BGA rework to compensate for irregularities or flatness, pad conditions and so forth? The Assembly Brothers, Jim Hall and Phil Zarrow, answer this question.
Board Talk
Removal of Coatings from PCBs
What the best way to remove coatings from assembled PCBs. Can you point me to some type of guide?
Ask the Experts
Cleaning for Reliability After QFN Rework
Cleaning for Reliability After QFN Rework
Paper makes an argument for removing flux residue under QFNs post rework, and present cleaning process options for this cleaning challenge.
Production Floor
 
 
The Global Automotive Revolution
The Global Automotive Revolution
Digital technologies won't just enhance the automobile; they will transform the very definition of what a vehicle is and how it will operate.
Technology Briefing
Grain Refinement for Improved Lead-Free Joint Reliability
In the study reported in this paper the effect of trace additions of selected elements on the grain structure of pure tin and lead-free solder alloys was observed.
Analysis Lab
 
 
Hi Pot Dielectic Breakdown
Hi Pot Dielectic Breakdown
How the Electrical Test industry combats requirements and provides solutions to adhere to ever changing requirements is discussed.
Materials Tech
Dispensing Underfill Can Be Tricky Business
Dispensing underfill can be a tricky process due to the fluctuating temperature in the work envelope.
Production Floor
 
 
Ask the Experts
MELF Component Misalignment
We have glued SMD MELF components that are misaligned after reflow. If we eliminate the gluing of the MELF components there is no misalignment.
Ask the Experts
Impact of Dust on PCB Assembly Reliability
What are the key characteristics of dust? Are some dust types worse than others? This paper presents some results towards answering these questions.
Analysis Lab
 
 
Screen Printing and Humidity
Screen Printing and Humidity
Solder paste is drying out inside our screen printer. How can we increase humidity to slow drying of our solder paste?
Board Talk
Measuring Conformal Coating Adhesion
Coating adhesion has been a difficult property to measure. This paper reviews a new tape peel test that can be applied to the PCB or component surface.
Materials Tech
 
 
         
Why Battery Powered Cars Are Not the Future
Why Battery Powered Cars Are Not the Future
The announcement by Tesla Motors that more than 325,000 people had deposited $1,000 each for its new Model 3 suggests that consumer demand for battery-powered electric cars is growing. Unfortunately the quest to own "the next new thing," could quickly sour into "the last old thing" when a superior technology comes along.
Technology Briefing
Influence of Salt Residues on BGA Head in Pillow
Influence of Salt Residues on BGA Head in Pillow
In this paper, a series of experiments was carried over to know the influence of specifically NaCl on BGA wetting given Head in Pillow (HiP) as result.
Production Floor
Ask the Experts
Delamination Dilemma
Can you point to any other potential causes of delamination or any other steps we should take to prevent it?
Ask the Experts
Peeling Paint Only On Wednesdays
Peeling Paint Only On Wednesdays
A line with spray painted parts was running smoothly except on Wednesdays when the paint would peel? Why only on Wednesdays?
Mysteries of Science
Cartoon
"I pruned a tree once, so technically I'm allowed to put 'branch manager' on my resume."
Copyright © Randy Glasbergen