Knowledge, Vision & Wisdom
Oct 20, 2016
Will Typical No Clean Paste Pass an SIR Test?
Will a typical no clean paste pass an SIR test? Is it really clean enough for a conformal coating and 20 years of service? The Assembly Brothers, Phil Zarrow and Jim Hall, provide some answers to these questions.
Hand Soldering vs. Selective Wave
Do you recommend a selective wave soldering process for an LCD glass display? Would the high heat cause thermal damage to the LCD?
Ask the Experts
New Placement Technology for Rework
This paper introduces a rework technology using cameras to identify the target area for component installation and component pin structure.
New Technology For De-Icing Plane Wings
Applying deicing agents to prevent ice on aircraft wings has consumed billions of dollars. This expense may soon become a thing of the past.
Signal Loss in a High Speed High Frequency Transmission Line
High speed transmission applications in electronic product have become a developing trend and one of the most important issue in the electronic industry.
Alternatives to Solder in Packaging and Assembly
This presentation surveys the landscape of alternatives to solder in interconnect, packaging, and assembly.
Spray Plus Soak Improves Cleaning Under BTC
Innovative spray and soak methods for removing low residue flux residues and rinsing under bottom termination and leadless components is evaluated.
BGA Joint Voids - Accept or Reject?
Per IPC-610, would you reject this BGA solder joint? I've heard that some level of voids within a BGA joint can actually improve reliability. Is this true?
Ask the Experts
A Control-Chart Based Method for Solder Joint Crack Detection
The purpose of this study is to evaluate the effect of failure criteria on the reported thermal fatigue life and find out which failure criterion can detect failure sooner.
How Many Fiducials Per Stencil
We have seen as many as 180 fiducials per stencil with a step and repeat. How many fiducials are recommended for a solder paste stencil?
Design of New Solder Attach Technologies
Paper outlines a new technology with a focus on design and research involved in the development of a new solder attach technology.
The Growth of Robot Farming
Farming needs to become more productive and less vulnerable to human contamination. There's a solution: vertical farming with robots.
Challenges for Step Stencil Printing
This paper focuses on the printing performance of step-up/step-down stencils and the paper ends up with a short outlook on 3D cavity printing.
Removal of Non-functional Pads from Inner Layers
Should we remove non-functional pads from inner layers. It may be necessary to free up space between rows of pads to route additional trace data.
Ask the Experts
Odd Measurements On Fridays
A research group tested prehistoric fish for mercury. They noticed that test measurements on Fridays were much higher. What was causing this?
Mysteries of Science
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