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Mar 30, 2017
Random Lifted Leads on QFP Components
Random Lifted Leads on QFP Components
After placement and reflow, we have a random lifted lead problem on some QFPs. What might be the cause? Where should we look? The Assembly Brothers, Jim Hall and Phil Zarrow, address these questions.
Board Talk
What Is Causing Sticky Stencil Blades?
We are having problems with solder paste sticking on our stencil blades generating a curtain between the blades and the stencil.
Ask the Experts
Stencil Printing for Miniaturized Electronics
Stencil Printing for Miniaturized Electronics
Paper covers experimental data and process optimization techniques employed to establish a precision SMT printing process.
Production Floor
Additive Manufacturing - Gimmick to Game-Changer
Additive Manufacturing - Gimmick to Game-Changer
Like most revolutionary technology, additive manufacturing is taking longer and creating less of an impact than envisioned.
Technology Briefing
2D and CT Scan X-ray for Joint Inspection
Paper discusses the conventional 2D X-ray inspection and CT scan techniques and shows various illustrations of defects which are normally difficult to detect.
Analysis Lab
Underfill Limitations for Future Packages
Underfill Limitations for Future Packages
The paper addresses the issue of underfill as die thickness diminishes, the interconnection bumps get smaller and their number increases.
Materials Tech
High-Volume-Manufacturing of BVA Enabled Advanced POP
We will present validation data for BVA high volume manufacturing including optimization of assembly process, yield, test and reliability.
Production Floor
Ask the Experts
Solder Paste Mixing After Cold Storage
After removal from cold storage, we let the solder paste jars sit. We then place the jars in a centrifuge machine. Is this a good practice?
Ask the Experts
Design Variables of Thermoforming Process on Printed Electronic Traces
This experiment provides insight into future design guidelines and process intellectual property for manufacturing printed electronic products.
Analysis Lab
What Causes Solder Balls During Hand Soldering?
What Causes Solder Balls During Hand Soldering?
We have experienced solder balls during automated reflow. Now we are finding solder balls during the hand soldering.
Board Talk
Developing a New Lead-Free Alloy
This paper discusses the process for development of a new lead-free alloy for high reliability, high temperature applications.
Materials Tech
         
How Commercial Drones Will Optimize the Supply Chain
How Commercial Drones Will Optimize the Supply Chain
Drone vehicles are becomming cheaper, smarter, more powerful, and more reliable. How will this technology enter the commercial supply chain?
Technology Briefing
AOI in an 01005 World
Paper discusses how AOI has become an essential tool to ensure a superior yield in the assembly of 01005 components.
Production Floor
Burned Chip Repair
I have a circuit board with a burned chip. Can this type of repair be done reliably? Where can I send this board to and have it done professionally?
Ask the Experts
 Flight of the Quadrotor
Flight of the Quadrotor
These amazing machines move with sniper precision both alone and together. Genuinely the scariest thing I've ever scene.
Mysteries of Science
Cartoon
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