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Knowledge, Vision & Wisdom Sep 27, 2016
Test for Spray Fluxer Uniformity
How can we verify that our spray fluxer is uniformly spraying flux over the entire surface of our circuit board? What's new in the world of spray fluxing? The Assembly Brothers, Jim Hall and Phil Zarrow, answer these questions.
Board Talk
Recommended Lead to Hole Ratio
What is the proper minimum gap between a round conductor lead and a PCB hole that will allow for a proper solder fill?
Ask the Experts
iNEMI Lead-free Wave Soldering Project
iNEMI Lead-free Wave Soldering Project
Paper provides an understanding of how wave soldering parameters correlate to performance and in selecting process parameters.
Production Floor
 
 
Open Source Artificial Intelligence
Open Source Artificial Intelligence
The open-source AI trend represents the convergence of two other powerful trends: The open-source movement and the artificial intelligence revolution.
Technology Briefing
Evaluating Accuracy of Thermocouple Attach Methods
The goal of this study was to identify a non-destructive method for thermocouple attachment that provides a small offset to the "actual temperature under a BGA."
Analysis Lab
 
 
HCFC-225 Phaseout, What Now?
HCFC-225 Phaseout, What Now?
The use restrictions on HCFC-225 are in effect throughout the US. This paper discusses the options for assemblers and component manufacturers.
Materials Tech
Electroplated Copper Filling of Through Holes
This paper discusses a through hole copper filling process for applications of high density interconnects and IC substrates.
Production Floor
 
 
Ask the Experts
Hard Water Contamination
I have a cleanliness problem with a batch of printed circuit assemblies. One batch appears polluted by ionic residues visible as a thin film.
Ask the Experts
Quantitative Analysis of Corrosion Resistance
An electrochemical method via sequential electrochemical reduction analysis instrument to quantify the corrosion resistance of the EN deposit is proposed.
Analysis Lab
 
 
Proper Exhaust Pressure for Reflow Ovens?
Proper Exhaust Pressure for Reflow Ovens?
What is the proper exhaust pressure for a reflow over? Where should we measure the pressure? How should we measure pressure?
Board Talk
Evaluation of Lead-free Solder Pastes
This paper discusses the strategy and methodology for selecting a good lead-free solder paste material for volume manufacturing uses.
Materials Tech
 
 
         
The Extraordinary Properties of Gold Nanoparticles
The Extraordinary Properties of Gold Nanoparticles
Gold nanoparticles have optical, electronic and chemical properties, which scientists are seeking to put to use.
Technology Briefing
Stencil Design for Ultra Fine Pitch Printing
Miniaturization is pushing the stencil printing process. As features become smaller, solder paste transfer efficiency is becoming more critical.
Production Floor
Ask the Experts
Contamination Prior to Conformal Coating
Can pink anti-static foam leave a residue on PCB's that may inhibit good adhesion of conformal coating?
Ask the Experts
The Day They Shut Down Intel
The Day They Shut Down Intel
Chipmaker Intel had just started up a new chip factory when something odd caused a shut down. What lead to this development?
Mysteries of Science
Cartoon
"We need to make room for the new hires. We're moving you to the cloud."
Copyright © Randy Glasbergen