Electronics Assembly Knowledge, Vision & Wisdom
Jun 27, 2017
Countries Most (and Least) Likely to be Affected by Automation
Countries Most (and Least) Likely to be Affected by Automation
Around the world, automation is transforming work, business, and the economy. But, the impact of robotics, AI and the Internet of Things, will vary widely from country to country.
Technology Briefing
Selective Soldering Frame Causing Cold Solder Joints
We have continual problems with cold solder joint on our wave soldering system. Could these be caused by using a selective soldering frame?
Ask the Experts
Cleaning for Reliability After QFN Rework
Cleaning for Reliability After QFN Rework
Paper makes an argument for removing flux residue under QFNs post rework, and present cleaning process options for this cleaning challenge.
Production Floor
Will High Humidity Affect Reflow Soldering?
Will High Humidity Affect Reflow Soldering?
Will higher than normal humidity in our facility affect reflow soldering? What impact might it have? The Assembly Brothers, Jim Hall and Phil Zarrow, address these questions and more.
Board Talk
Corrosive Driven Whisker Growth in SAC305
This paper reports a study directed at identifying the relationship between the extent of corrosion and the concomitant whisker growth.
Analysis Lab
Hot Air Solder Leveling in the Lead-free Era
Hot Air Solder Leveling in the Lead-free Era
Paper discusses best practice for lead-free HASL lines and the properties expected with a properly applied HASL finish.
Materials Tech
Selective Reflow Rework Process
This paper discusses some aspects of the process optimization and changes made to improve the quality of the rework process.
Production Floor
Ask the Experts
Test Probe Problems After Pin-In-Paste
We are having test probe contact issues with our Pin-In-Paste process. Should all the flux vaporize off in the reflow process? Any suggestions?
Ask the Experts
Pb-Free Thermal Cycle Acceleration Factors
Paper discusses the calculation of acceleration factors for different Pb-free solders, comparing results with those for eutectic SnPb.
Analysis Lab
Max Time Between Soldering and Cleaning
Max Time Between Soldering and Cleaning
What is the maximum staging time permissible for PCBA's between wave soldering and cleaning? Is there an industry standard?
Board Talk
Gold Stud Bump Flip Chip Attachment
Flip chip bonding is a desirable attachment approach for minimizing size. This paper compares immersion and auto catalytic gold plating processes.
Materials Tech
Wireless Infrared Networks
Wireless Infrared Networks
Researchers have developed a wireless network based on harmless infrared rays. The capacity is more than 40 Gbit/s per ray and every device gets its own ray.
Technology Briefing
Assembly of Fine Pitch PoP Components
Assembly of Fine Pitch PoP Components
Paper focuses on assembly variations for PoP components with .4 mm pitch on the lower package and .5mm pitch on the upper.
Production Floor
Hot Air Solder 0201s and 01005s
We are struggling to solder and rework small parts - 0201s and 01005s. I have been using a small nozzle hot air solder rework station with adjustable air flow.
Ask the Experts
Trapped in the Vacuum Chamber
Trapped in the Vacuum Chamber
A worker was cleaning inside a vacuum chamber when the door slammed shut. His partner turned the vacuum pump on. What happened?
Mysteries of Science
Cartoon
"I pruned a tree once, so technically I'm allowed to put 'branch manager' on my resume."
Copyright © Randy Glasbergen
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