Electronics Assembly Knowledge, Vision & Wisdom
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Apr 20, 2017
Sticky Residue Under Low Clearance Parts
Sticky Residue Under Low Clearance Parts
We are finding a tacky substance under a large SMT component. Is this common when no-clean leaded solder paste is used with no clearance parts? The Assembly Brothers, Phil Zarrow and Jim Hall, offer their experience.
Board Talk
Insufficient Heel Fillets with PLCC J Lead Components
We have an insufficient solder joint heel fillet with a PLCC J lead component. Testing indicates we need additional solder at the heel joint.
Ask the Experts
Fill the Void II: An Investigation into Methods of Reducing Voiding
Fill the Void II: An Investigation into Methods of Reducing Voiding
This paper is a continuation of previous work on voiding. The voiding results are summarized and recommendations made for reduction of voiding.
Production Floor
Robots At War
The U.S. military's successful deployment of drones in combat provides a glimpse into the future of warfare.
Technology Briefing
Investigation into Lead-Free Low Silver Solder Wire for Electronics
Investigation into Lead-Free Low Silver Solder Wire for Electronics
This paper show results using a lead-free solder rework wire alloy in terms of wetting, reduced solder iron tip erosion, reduced IMC growth and reliability.
Production Floor
Reducing Defects with Embedded Sensing
Reducing Defects with Embedded Sensing
This paper covers sensing technologies to guarantee that only good PCBs pass the assembly process, reducing rework and improving efficiency.
Materials Tech
Wearable Electronics & Big Data = High Volume, High Mix SMT
This paper explores the conflicting requirements of achieving low cost while meeting high volume, high mix requirements.
Production Floor
Ask the Experts
Frequency of Checking Solder Paste Viscosity
Is it necessary to check viscosity of solder paste before each use? How often should we check and verify solder paste viscosity?
Ask the Experts
Reliability Assessment of Reballed BGAs
In this paper, SAC305 solder balls were replaced with SnPb solder balls and tested to evaluate the reliability of these reballed components.
Analysis Lab
Is There a Limit to the Step in a Step Stencil?
Is There a Limit to the Step in a Step Stencil?
I've seen a problem with the 3-mil step. Is there a rule of thumb regarding the amount of step that can used in a step stencil?
Board Talk
Insertion Loss Comparisons of High Frequency PCBs
PCBs have been used for many years in low loss, high frequency microwave applications and many have become increasingly complex.
Materials Tech
         
Rebooting the IT Revolution
U.S. dominance has largely been unchallenged throughout but Americans can't afford to remain complacent. What are the opportunities and threats?
Technology Briefing
Coreless Package Substrate Issues and Challenges
This paper addresses the major challenges of reducing coreless substrate warpage in terms of both substrate manufacturing and assembly process.
Production Floor
Is Rework Unacceptable?
We have a customer who insists that assemblies should not be reworked. They will not accept boards which have been reworked. Is this practical?
Ask the Experts
The Phantom Switch
The Phantom Switch
A flat panel switch turned on but only when a nearby door was slammed shut. What was causing the switch to activate?
Mysteries of Science
Cartoon
"This problem requires immediate action. Hire another scapegoat!"
Copyright © Randy Glasbergen