Electronics Manufacturing and Electronics Assembly

What is your experience with larger size apertures and type four solder paste for non-collapsible BGA and CGA type solder joints? The Asembly Brothers, Phil Zarrow and Jim Hall, discuss this question and share their advice and suggestions.
Board Talk

The Dynamics of Low Stress Epoxy Curing
This study compares uniform variable frequency microwave (VFM) field cure to standard oven curing at temperatures below Tg (transition temperature).
Production Floor

System to Efficiently Produce Solar Thermochemical Hydrogen
In a study recently published, engineers lay out the conceptual design for a system that can efficiently produce “solar thermochemical hydrogen.”
Technology Briefing

Effect of EPIG Plating Thicknesses on Solder Joint and Wire Bond Reliability
This study focuses on determining the effects of palladium and gold thicknesses to ensure dependable solder joints and wire bonds.
Analysis Lab

Cu Conductive Paste as Via Filling Materials for Various Substrates
In this study, we developed a Cu paste that can be used as a filling material for through silicon via (TSV), through glass via (TGV), and organic substrates.
Materials Tech

Cohesive Zone Modeling of Failure Underfilled BGA-PCB Assemblies
A model was developed to simulate the delamination behavior of multilayer PCBs assembled with BGA components reinforced with an underfill epoxy adhesive.
Production Floor

Lessons Learned While Investigating Microvia Reliability Failures
There has been an increasing number of reports concluding that stacked micro vias are failing preferentially when compared to an alternative staggered via design.
Analysis Lab

What is the IPC Definition for Uncommonly Harsh?
IPC 610 defines class three to include products where the end use environment may be uncommonly harsh. How is uncommonly harsh defined?
Board Talk

Insulation Resistance of Dielectric Materials
This investigation measures the leakage within internal PCB layers during exposure of various specimens to a controlled ground-based test environment.
Materials Tech

Implementing 3D Integration with 2D Materials
In a new study, researchers identify a potentially game-changing remedy: seamlessly implementing 3D integration with 2D materials.
Technology Briefing

Assembly Process Feasibility of Low Silver Solder Paste
This paper presents performance/process capability of various low/no silver alloy solder pastes.
Production Floor

Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
This study qualifies an aqueous cleaning process capable of removing combinations of no-clean flux residues for Class III electronic assemblies.
Analysis Lab

Innovative Impromptu Air Conditioning
One July the chiller at an old factory was using more electricity than normal. What was causing the chiller to use more electricity?
Mysteries of Science

Complex Board Design Induced Solder Separation Failure
The study elaborates the parameters with the solder separation failure per board design configuration, and also provides the potential solution to mitigate the failure.
Production Floor

Self-Driving Labs Use AI and Robots to Expedite Research

At a minimum, “self-driving labs,” make use of artificial intelligence (or AI) and automated robotic systems to expedite research and discovery.
Technology Briefing

Development of Si-Interposers for 3D Heterogeneous Integration
This paper will review the status of the ongoing interposer development program and provide details on the process capabilities that have been established.
Analysis Lab

Long Term Thermal Reliability of Printed Circuit Board Materials

This paper describes the purpose, methodology, and results to date of thermal endurance testing performed at the company.
Materials Tech

Strain During Press Fit Connector Insertion in PCB Assembly
Locations closer to the insertion site experienced the highest level of strain, which progressively decreased further from the insertion location.
Production Floor

Board Talk

Larger Stencil Apertures and Type 4 Paste

What is the IPC Definition for Uncommonly Harsh?

Component Moisture Question?

Causes of Blowholes

How To Verify Cleanliness After Rework and Prior to Re-coating?

Assembling Boards with BGAs on Both Sides

Demise of the Plated-Through Hole?

5 vs 8-Zone Ovens

MORE BOARD TALK

Questions and Comments

Problem Meeting Minimum Hole Fill During Wave Soldering

Everything that has been described is correct. If it is ...
Juergen Friedrich, Ersa GmbH

Problem Meeting Minimum Hole Fill During Wave Soldering

Our past experience is that the use of an inert ...
Gregory K Arslanian, Air Products and Chemicals, Inc.

Is No-Clean the Trend for QFN Components?

We work with smaller assemblies with small QFN and smaller ...
Tim Smith, Base2 Engineering a BlueHalo Company

MORE COMMENTS